Description
Diamond wire cutting is a state-of-the-art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub-surface damage, and contamination-free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price.
| Part Number |
EQ-DW0125x65 |
| Tensile Strength |
30 N |
| Features |
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