Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD

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RM0.00 MYR
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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD
  • Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD
Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package - ECO-419-LD

SKU: eco-419-ld

Price: RFQ

Description

 EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with  < 6" diameter vacuum chuck. SPECIFICATIONS: Width 6.5" Thickness 0.25mm Length Price sold by 10 feet per quantity Item It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing. Application Notes

Width

6.5"

Thickness

0.25mm

Length

Price sold by 10 feet per quantity

Item

It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing.

Application Notes