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Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12
  • Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12
  • Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12
  • Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12
  • Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12
  • Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12
Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12

Max. 550C Heating Jacket and Temperature Controller with 12mm ID Si3N4 Pressing Die - HC-SiN-12

SKU: hc-sin-12

Price: RFQ

Specifications

 EQ-HC-SiN is designed for heating 12mm I.D. Silicon Nitride Pellet Pressing Die with Heating jacket (550°C Max.) and Temperature Controller. Programmable Temperature Controller is standard from 03/09/2021. SPECIFICATIONS: Model HC12SiN HC20SiN Structure The 12mm SiN Heating Die Set includes: A set of 12mm Silicon Nitride Pellet Pressing Die - Die-SiN Die Sleeve: 30mm O.D. x 12mm I.D. x 40mm H Upper Pushing Rod: 12mm Dia. x 40mm H Lower Rod: 12mm Dia. x 10mm H Mold Release Rod Mold Release Sleeve Upper and Lower Supporting Plate Heat Insulation Plate with mica Heating Jacket: 65mm O.D. x 40mm H Copper Adapter: 39mm O.D. x 30mm I.D. x 40mm H Single Set Point Temperature Controller - MTC1000 The 20mm SiN Heating Die Set includes: A set of 20mm Silicon Nitride Pellet Pressing Die - Die-SiN Pressing Die Sleeve: 40mm O.D. x 20mm I.D. x 40mm H Upper Pushing Rod: 20mm Dia. x 40mm H Lower Rod: 20mm Dia. x 10mm H Mold Release Rod Mold Release Sleeve Upper and Lower Supporting Plate Heat Insulation Plate with mica Heating Jacket Ø58×Ø50×40 mm Copper adapter Ø50×Ø40×40 mm Single Set Point Temperature Controller - MTC1000 Voltage AC 220V 50/60Hz (for 110V, please order a 750W transformer ) Power 550W Working Temperature and Pressure Temperature: RT - 500 ºC Pressure: 100 MPa Temp. control method Programmable PID temperature controller with a type-K thermocouple. Temperature Accuracy: +/- 2°C Application Note Please always wear protective goggles during the operation !!! The heating and cooling temperature rate should be below 5 °C/min The volume of feeding material should be below 1/3 total volume of Si3N4 sleeve. Over-feeding material may cause damage to the sleeve at high temperatures. Suggest using 32~75 microns particles for pressing (Pic.1) Please clean the mold after the completion of each experiment.

 Model HC12SiN HC20SiN
Structure





 		The 12mm SiN Heating Die Set includes:
  • A set of 12mm Silicon Nitride Pellet Pressing Die - Die-SiN
    • Die Sleeve: 30mm O.D. x 12mm I.D. x 40mm H
    • Upper Pushing Rod: 12mm Dia. x 40mm H
    • Lower Rod: 12mm Dia. x 10mm H
  • Mold Release Rod
  • Mold Release Sleeve
  • Upper and Lower Supporting Plate
  • Heat Insulation Plate with mica
  • Heating Jacket: 65mm O.D. x 40mm H
  • Copper Adapter: 39mm O.D. x 30mm I.D. x 40mm H
  • Single Set Point Temperature Controller - MTC1000
The 20mm SiN Heating Die Set includes:
  • A set of 20mm Silicon Nitride Pellet Pressing Die - Die-SiN
    • Pressing Die Sleeve: 40mm O.D. x 20mm I.D. x 40mm H
    • Upper Pushing Rod: 20mm Dia. x 40mm H
    • Lower Rod: 20mm Dia. x 10mm H
  • Mold Release Rod
  • Mold Release Sleeve
  • Upper and Lower Supporting Plate
  • Heat Insulation Plate with mica
  • Heating Jacket Ø58×Ø50×40 mm
  • Copper adapter Ø50×Ø40×40 mm 
  • Single Set Point Temperature Controller - MTC1000
Voltage
Power 
  • 550W
Working Temperature 
 and Pressure
  • Temperature: RT - 500 ºC 
  • Pressure: 100 MPa 
Temp. control method
Application Note
  • Please always wear protective goggles during the operation !!!
  • The heating and cooling temperature rate should be below 5 °C/min
  • The volume of feeding material should be below 1/3 total volume of Si3N4 sleeve. Over-feeding material may cause damage to the sleeve at high temperatures.
  • Suggest using 32~75 microns particles for pressing (Pic.1)
  • Please clean the mold after the completion of each experiment.

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