Diamond on Silicon Wafer(DOS), 5x5mm , 2 um Thick, 10 nm Ra

Specifications

• Wafer Size:5mmx5mmx0.5mm
• Silicon wafer Orientation: (100) + / - 0.5^o
• Diamond film thickness:   2 micron
• Resistivity: 10E3 ~ 10E4 ohm-cm
• Surface roughness:  one sides CMP polished with surface roughness < 10 nm
• Package: One 1000 class clean room with 100 class plastic bag

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