Ge Wafer (111) 2" dia x 0.5 mm, 2SP, N type ( Sb doped), R: 10-20 ohm-cm

Specification

• Growing Method: CZ
• Orientation: (111) +/_0.5 Deg.
• Wafer Size: 2" dia x  500 microns  
• Surface Polishing: two side epi polished
• Surface roughness: < 8 A ( by AFM)
• Doping: Sb Doped
• Conductor type: N-type
• Resistivity: 10-20Ohms/cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.)
• Package: under 1000 class clean room     

Typical Properties:

• Structure: Cubic, a = 5.6754 A
• Density: 5.323 g/cm3 at room temperature
• Melting Point: 937.4 ^oC
• Thermal Conductivity: 640

Target  A-Z	Crystal Substrate A-Z	Plasma/UO Cleaner	Round Wafer Carriers	Cutting/Dicing Saws	Film Coaters