Ge Wafer (211) N-type Undoped, 2" dia x 0.45 mm, 1SP, resistivities: >45 ohm-cm

Specification

• Growing Method:              CZ
• Orientation:                      (211) +/_0.5 Deg.
• Wafer Size:                      2" dia x  450 microns  
• Surface Polishing:             one side epi polished
• Surface roughness:           < 8 A ( by AFM)
• Doping:                            Undoped
• Conductor type:                N-type
• Resistivity:                        > 45 Ohms/cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.)
• Package:                           under 1000 class clean room     

Typical Properties:

• Structure:                         Cubic, a = 5.6754 A
• Density:                            5.323 g/cm3 at room temperature
• Melting Point:                    937.4 ^oC
• Thermal Conductivity:         640

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