Description
Substrate Specifications:
- Wafer Size: 0.25'' x 0.25'' x 0.5 mm thickness +/-0.05 mm,
- Wafer Orientation: (100) +/-0.5 Deg
- Polishing: One side CMP polished with free sub-surface damage.
- Surface finish (RMS or Ra) : < 10A
- Package: Under 1000 class clean room, and in a 100-grade plastic bag in a wafer container.
- Lattice Constant a=3.792Å Pseudocubic
- Warning: LaAlO3 crystal has a visible twin on a polished surface, which is of normal nature., please picture below
