Description
Specifications
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Growing Method: CZ
- Wafer Size: 5x5x0.5 mm
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Surface Polishing: Two sides epi polished
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Orientation: (111)
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Surface roughness: < 8 A ( by AFM)
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Doping: Sb-doped
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Conductor type: N-type
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Resistivity: 0.005-0.01 Ohms/cm
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EPD: N/A
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Package: under 1000 class clean room in wafer container


