Thermal Oxide Wafer: 100 nm SiO2 Layer on Si (100), 4"dia x 0.525 mm , N type , P doped, 1SP R: 0.1-1.0ohm.cm - Fm100SOonSIPa100D0525C1R01US

Thermal Oxide Wafer: 100 nm SiO2 Layer on Si (100), 4"dia x 0.525 mm , N type , P doped, 1SP R: 0.1-1.0ohm.cm - Fm100SOonSIPa100D0525C1R01US

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Thermal Oxide Wafer: 100 nm SiO2 Layer on Si (100), 4"dia x 0.525 mm , N type , P doped, 1SP R: 0.1-1.0ohm.cm - Fm100SOonSIPa100D0525C1R01US

Thermal Oxide Wafer: 100 nm SiO2 Layer on Si (100), 4"dia x 0.525 mm , N type , P doped, 1SP R: 0.1-1.0ohm.cm - Fm100SOonSIPa100D0525C1R01US

SKU: thermal-oxide-wafer-100-nm-sio2-layer-on-si-100-4dia-x-0-525-mm-n-type-p-doped-1sp-r-0-1-1-0ohm-cm-fm100soonsipa100d0525c1r01us

Price: RFQ

Description

Thermal oxide Layer

  • Research Grade , about 80 % useful  area
  • SiO2 layer on 4'' Silicon wafer
  • Oxide layer thickness: 100 nm   ( 1000A)  +/-10%  for each side  ( coatd on both sides )
  • Refractive index - 1.455

Silicon Wafer Specifications:

  • Conductive type:          N-type/ P-doped 
  • Resistivity:                  0.1-1.0  ohm.cm   (If you would like to measure the resistivity accurately, 
                                      please order our Portable 4 Probe Resistivity Testing Instrument.) 
  • Size:                         4" +/- 0.5 mm x 0.525 mm
  • Orientation:                (100) +/- 1o
  • Polish:                        one side polished
  • Surface roughness, Ra: < 5A (RSM) 



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