Description
Specification
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Growing Method: VGF
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Orientation: (100) +/-0.5 Deg.
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Wafer Size: 100mm dia x 500 microns
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Surface Polishing: One side epi polished
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Surface roughness: RMS or Ra:~ 10 A(By AFM)
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Conductor type: N-type
- Dopant: As-Doped
- Resistivity: 0.088-0.25ohm.cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.)
- Carrier concentration: (0.78-3.02)x10^16/c.c
- Mobility: 2350-3010 cm^2.v.s
- EPD: < 500 /cm^2
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Ra(Average Roughness) : < 0.4 nm
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Package: under 1000 class clean room
Typical Properties:
- Structure: Cubic, a = 5.6754 A
- Density: 5.323 g/cm3 at room temperature
- Melting Point: 937.4 oC
- Thermal Conductivity: 640


