DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

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DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater - VTC-600-2HD-LD

SKU: vtc6002hdld

Price: RFQ

Description

VTC-600-2HD-LD is a compact magnetron sputtering system with dual 2" target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material. This coating system is capable for co-sputtering or deposition of multiple layer films for a wide range of materials, such as alloy, ferroelectric, semiconductor, ceramic, dielectric, optical, PTFE, etc. (Revised since 9/25/2015. Film Thickness Monitor is not included.) SPECIFICATIONS Power 208-240 VAC, single phase, 50/60 Hz, 500 W Source Power DC source : 500 W power for coating metallic materials RF source : 300 W power, 13.56 MHz frequency for coating non-conductive materials Magnetron Sputtering Head Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters One is connected to a DC source for metallic materials The other is connected to the RF source for non-conductive materials Target size: 2" diameter with a thickness of 0.1 - 5 mm Sputtering targets are optional Recommended Sputtering Recipe and Useful Tips 3 RF heads model is available Extra 148 cm RF cable can be ordered at extra cost for the replacement Four heads sputtering system is available upon request (Pic. 5) Pic. 5 Vacuum Chamber Stainless steel vacuum chamber: Ø300 × 300 mm H One 100 mm glass view port. Hinged type top flange for easy sample access Here is a glance of the vacuum chamber Sample Stage Ø140 mm rotating and heating sample stage up to 500°C Rotation speed: 1 - 20 rpm Single-point programmable temperature controller Gas Flow Control Two mass flow controllers (MFC) Flow rate: 0 – 200 sccm nitrogen calibrated 1/4" vent port. Vacuum Pump Station (Optional) For air-sensitive targets, such as Al, Ti, Cr, etc, or base pressure <1e-2 torr, a pumping station is recommended Turbo pump . 63 L/s turbomolecular pump , or 260 L/s turbomolecular pump Backing pump 240 L/min rotary vane pump , or 200 L/min dry scroll pump Water Chiller (Optional) Chilled water is required One digital temperature-controlled recirculating water chiller is recommended Refrigeration range: 5~35 °C Flow rate: 16 L/min Pump pressure: 14 psi Film Thickness Measurement (Optional ) Quartz crystal microbalance for in-situ film thickness measurement is optional. Accuracy up to 1Å Overall Dimensions Lid closed: 48" × 28" × 32" Lid open: 48" × 28" × 37" Net Weight of Coater 160 kg Shipping Weight & Dimensions Total 2 Pallets #1: 520 lbs, 52" x 40" x 50" #2: 420 lbs, 48" x 40" x 45" Compliance CE approval NRTL Certification (UL 1450) is available upon request at extra cost Application Notes Please use 5N purity Argon gas for plasma sputtering. For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below) MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order) MTI Sputtering Coaters have successfully coated ZnO on Al 2 O 3 substrate at 500 °C (XRD profile in Pic #5 below) HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations DO NOT use DI water in a water chiller. Use distilled water The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together) Pic 3 Pic 5 Pic. 6

Power
  • 208-240 VAC, single phase, 50/60 Hz, 500 W
Source Power
  • DC source: 500 W power for coating metallic materials 
  • RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials

Magnetron Sputtering Head




Vacuum Chamber

  • Stainless steel vacuum chamber: Ø300 × 300 mm H
  • One 100 mm glass view port. 
  • Hinged type top flange for easy sample access
  • Here is a glance of the vacuum chamber
  •      



Sample Stage

  • Ø140 mm rotating and heating sample stage up to 500°C 
  • Rotation speed: 1 - 20 rpm
  • Single-point programmable temperature controller
  •  

Gas Flow Control

Vacuum Pump Station

(Optional)

Water Chiller

(Optional)

  • Chilled water is required
  • One digital temperature-controlled recirculating water chiller is recommended
    • Refrigeration range: 5~35 °C
    • Flow rate: 16 L/min
    • Pump pressure: 14 psi
Film Thickness Measurement
(Optional )


Overall Dimensions

Net Weight of Coater

  • 160 kg

Shipping Weight & Dimensions

  • Total 2 Pallets
    • #1: 520 lbs, 52" x 40" x 50"
    • #2: 420 lbs, 48" x 40" x 45"

Compliance

  • CE approval
  • NRTL Certification (UL 1450) is available upon request at extra cost

 Application Notes

  • Please use 5N purity Argon gas for plasma sputtering. 
  • For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding (Click Pic #3 below)
  • MTI supplies single crystal substrate from A to Z (Click Pic #4 below to order) 
  • MTI Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C (XRD profile in Pic #5 below)
  • HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
  • DO NOT use DI water in a water chiller. Use distilled water
  • The coater can be placed into glovebox as the Pic. 6 at extra cost ( must order glovebox together)
  •  Pic 3  Pic 5 Pic. 6
,
 Pic 3  Pic 5 Pic. 6